| A半導體元件暨封裝組 |
1-1 |
矽材半導體元件
Silicon-based semiconductor devices |
| 1-2 |
化合物半導體元件
Compound semiconductor devices |
| 1-3 |
微機電元件
MEMS devices |
| 1-4 |
有機半導體元件
Organic semiconductor devices |
| 1-5 |
電子陶瓷元件
Electronic ceramic devices |
| 1-6 |
奈米應用元件
Nano devices |
| 1-7 |
半導體封裝技術
Semiconductor packaging technology |
| 1-8 |
半導體封裝材料
Semiconductor packaging material |
| 1-9 |
半導體封裝量測
Semiconductor packaging measurement |
| B半導體材料組 |
2-1 |
化合物半導體材料
Compound Semiconductor Materials |
| 2-2 |
積體電路相關材料
ULSI Materials |
| 2-3 |
MOS Gate氧化膜材料
MOSFET Gate Oxide Materials |
| 2-4 |
半導體領域相關新材料
New Semiconductor Materials |
| 2-5 |
生化半導體材料
Bio/Chemical Materials Combined with Semiconductor |
| 2-6 |
奈米材料
Nano Materials |
| C電路設計與應用組 |
3-1 |
系統晶片設計
System of chip |
| 3-2 |
積體電路設計
VLSI Design |
| 3-3 |
射頻電路設計
RF circuit design |
| 3-4 |
能源系統與設計
Energy System and Design |
| D訊號與系統組 |
4-1 |
數位訊號處理
Digital signal processing |
| 4-2 |
通訊理論與系統
Communication principles and systems |
| 4-3 |
多媒體通訊
Multimedia communication |